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DCB Ceramic Substrate
Active Metal Brazing
What is active metal brazing?
Active metal brazing process is a further development of DCB technology. This technology is a method to use some small quantity active elements contained in the brazing paste, that is Ti, Zr, to react with ceramic and then generate a reaction layer which can be wetted by the liquid state brazing paste, so that to realize the bonding of ceramic and mental. As the bonding of AMB substrate is realized by the reaction of ceramic and brazing paste containing active metal elements under high temperature, its bonding strength is higher and reliability is better. Therefore, this technology is more suitable to prepare the copper coved ceramic substrate which is used for packaging IGBT module for electric vehicle and locomotive.
AMB performance advantage
Excellent bonding strength and shape adaptation
Good electric current carrying capacity
Better heat-sinking capability
AMB performance advantage
Better mechanical property
Better reliability
Tel: 021-36160564
Electric Vehicle
Electric Vehicle
Electric Vehicle
Electric Vehicle
Solar power
Solar power
Rail traffic
Rail traffic
Green building
Green building
Heat pump
Heat pump
AMB application
As the bonding of AMB substrate is realized by the reaction of ceramic and brazing paste containing active metal elements under high temperature, its bonding strength is higher and reliability is better. Therefore, this technology is more suitable to prepare the copper coved ceramic substrate which is used for packaging IGBT module for electric vehicle and locomotive. Particularly in some fields like wind power, solar power, heat pump, water and electricity, biomass energy, green building, new energy equipment, electric vehicle, rail traffic and other important fields, the copper covered ceramic substrate, as the key material of IGBT module packaging, will be largely demanded with the rapid development of power electronic technology.
Matrix diagram of applications in various fields
Semiconductor correlation
DCB Ceramic Substrate

Thermoelectric refrigerator;

Wind power stations;

Solar energy converter;

LED lighting；

IGBT module;

IPM module;

MOS modules;

Power supply;

ABS;

Electronic transmission;

LED lamp;

Hybrid cars;

Electric cars;

High-speed railway/bullet train;

White household appliance;

Thermoelectric module;
Production base
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